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| '''TFROM''' (NES-TFROM and HVC-TFROM) is a common board within the [[TxROM]] set. Like other TxROM boards, TFROM uses the [[MMC3|Nintendo MMC3]] ASIC.
| | #REDIRECT [[TxROM]] |
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| == Overview ==
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| * PRG ROM size: 128, 256 or 512 KB (DIP-28/32 Nintendo pinout)
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| * PRG ROM bank size: 8 KB
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| * PRG RAM: None
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| * CHR capacity: 32 or 64 KB ROM (DIP-28 standard pinout)
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| * CHR bank size: 1 KB and 2 KB
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| * Nametable [[mirroring]]: Solder pads select horizontal, vertical or controlled by mapper.
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| * Subject to [[bus conflict]]s: No
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| == Solder pad configuration ==
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| * Normal mode : 'CL1' connected, 'H' disconnected, 'V' disconnected, 'CL2' connected.
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| * [[DEROM]] backward compatibility mode with Horizontal mirroring : 'CL1' disconnected, 'H' disconnected, 'V' connected, 'CL2' disconnected.
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| * DEROM backward compatibility mode with Vertical mirroring : 'CL1' disconnected, 'H' connected, 'V' disconnected, 'CL2' disconnected.
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| Note : In DEROM backward compatibility mode, mirroring is hardwired and IRQs are disabled. However, the additional bank switching modes available by the MMC3 that weren't available with the MIMIC-1 chip used on DEROM boards are still present.
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| Connecting 'CL1' enables MMC3-controlled mirroring, while connecting 'CL2' enables IRQs.
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| == See also ==
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| *[[MMC3|Nintendo MMC3]]
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