Talk:INES Mapper 243: Difference between revisions
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What specifies the solder pad? (both in hardware and for an emulator) I don't see a pin on the pinout that could relay it...? —[[User:Lidnariq|Lidnariq]] ([[User talk:Lidnariq|talk]]) 14:43, 7 December 2019 (MST) | What specifies the solder pad? (both in hardware and for an emulator) I don't see a pin on the pinout that could relay it...? —[[User:Lidnariq|Lidnariq]] ([[User talk:Lidnariq|talk]]) 14:43, 7 December 2019 (MST) | ||
== L-shaped mirroring layout == | |||
Old documentation said that L-shaped mirroring was OR2(PPU A10,PPU A11) (i.e. top left is unique). In contrast, the current documentation seems to say it's OR2(NOT(PPU A10),PPU A11) (i.e. top right is unique). Is this a typo, my misinterpretation, or a change in documentation? —[[User:Lidnariq|Lidnariq]] ([[User talk:Lidnariq|talk]]) 15:53, 7 December 2019 (MST) | |||
Revision as of 22:53, 7 December 2019
Solder Pad
What specifies the solder pad? (both in hardware and for an emulator) I don't see a pin on the pinout that could relay it...? —Lidnariq (talk) 14:43, 7 December 2019 (MST)
L-shaped mirroring layout
Old documentation said that L-shaped mirroring was OR2(PPU A10,PPU A11) (i.e. top left is unique). In contrast, the current documentation seems to say it's OR2(NOT(PPU A10),PPU A11) (i.e. top right is unique). Is this a typo, my misinterpretation, or a change in documentation? —Lidnariq (talk) 15:53, 7 December 2019 (MST)
