Famicom cartridge dimensions: Difference between revisions

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== Famicom cartridge PCB outline ==
== Famicom cartridge PCB outline ==


=== HVC-TxROM ===
These outlines of different cartridge PCB types are based on the most space-filling variant, so that designers may choose to cut off unused portions that their designs may not need. Some outlines of cartridges with no maximally space filling PCB are thus modified to be such, with measurements being based on adjacent types made by the same producer.
This outline is based on measurements from a HVC-TGROM-01 cartridge, so it should be compatible with any cartridge shell that supports any HVC-TxROM/SxROM PCB or similar/bigger. These measurements should approximate closely, as it assumes a 1/128 inch grid.
 
[[File:HVC-TGROM-01-board.svg|frame|center|HVC-TGROM-01 PCB outline and dimensions]]
Each cartridge type varies in how the 60 pin card edge is implemented. The pin pitch is 2.54mm, with 2 rows of 30 pads. Each pad may be uniform in dimensions, or slightly thicker and longer for power/ground.
 
=== HVC-Ax/Fx/Px/Sx/TxROM (MMC1-4 mapper boards) ===
This outline is based on measurements from a HVC-TGROM-01 type cartridge PCB, compatible with any cartridge shell that supports any HVC-Ax/Fx/Px/Sx/TxROM PCB or similar/bigger. These measurements are measured with vernier calipers with 0.05 mm accuracy. Note that this outline also details where the soldermask ends for the card edge.
 
[[File:HVC-TGROM-01-board.svg|frame|center|Technical drawing of the outlines of an HVC-TGROM-01 type cartridge PCB.]]
 
{| class="wikitable" align="center" style="margin: auto;"
!colspan="3"|Dimensions
|-
|Designator ||Dimensions in mm (±0.05 mm) ||Description
|-
|A ||90 ||Board width
|-
|A.1 ||78.4 ||Card edge width
|-
|A.2 ||81 ||Notched width
|-
|A.2.1 ||43 ||Inset board width 1
|-
|A.2.2 ||33 ||Inset board width 2
|-
|B ||46.1 ||Board height
|-
|B.1 ||23.2 ||Inset board height 1
|-
|B.2 ||20.9 ||Inset board height 2
|-
|B.3 ||10.7 ||Card edge depth
|-
|C ||1.2 ||Board thickness
|-
|D.1 ||3 ||Card edge base to pad top
|-
|D.2 ||4 ||Card edge base to soldermask keepout
|-
|D.3 ||6.7 ||Power pad height
|-
|D.4 ||5.7 ||Signal pad height
|-
|E.1 ||0.57 ||Power pad to card edge side
|-
|E.2 ||1.57 ||Signal pad to card edge side
|-
|E.3 ||2.6 ||Power pad width
|-
|E.4 ||1.6 ||Signal pad width
|-
|E.5 ||0.94 ||Space between pads
|-
|E.6 ||2.54 ||Pad spacing
|}


=== HVC-ExROM ===
=== HVC-ExROM ===
''TODO: measure and publish dimensions''
''TODO: measure and publish dimensions''


=== HVC-NROM/CNROM ===
=== HVC-N/Cx/Gx/UxROM 01-05 (discrete mapper boards) ===
''TODO: measure and publish dimensions''
This outline is based on measurements from a HVC-CNROM-256K-01 type cartridge PCB, augmented with dimensions from a HVC-TGROM-01 type PCB. This is compatible with any cartridge shell that supports any HVC-N/Cx/Gx/UxROM 01-05 PCB or similar/bigger. These measurements are measured with vernier calipers with 0.05 mm accuracy. Note that this outline also details where the soldermask ends for the card edge.
 
[[File:HVC-CNROM-256K-01-board.svg|frame|center|Technical drawing of the outlines of an augmented HVC-CNROM-256K-01 type cartridge PCB.]]
 
{| class="wikitable" align="center" style="margin: auto;"
!colspan="3"|Dimensions
|-
|Designator ||Dimensions in mm (±0.05 mm) ||Description
|-
|A ||90 ||Board width
|-
|A.1 ||78.4 ||Card edge width
|-
|A.2 ||68 ||Notched width
|-
|A.2.1 ||31.5 ||Inset board width 1
|-
|A.2.2 ||26.5 ||Inset board width 2
|-
|A.3 ||39.5 ||Hole 1 to board edge
|-
|A.4 ||1/2 of A ||Hole 2 to board edge
|-
|A.5 ||3 ||Hole 1 diameter
|-
|A.6 ||5 ||Hole 2 diameter
|-
|B ||46.1 ||Board height
|-
|B.1 ||23.2 ||Inset board height 1
|-
|B.2 ||20.9 ||Inset board height 2
|-
|B.3 ||10.7 ||Card edge depth
|-
|B.4 ||19.8 ||Hole 1 center height
|-
|B.5 ||10.3 ||Hole 2 center height
|-
|C ||1.2 ||Board thickness
|-
|D.1 ||3 ||Card edge base to pad top
|-
|D.2 ||4 ||Card edge base to soldermask keepout
|-
|D.3 ||6.7 ||Power pad height
|-
|D.4 ||5.7 ||Signal pad height
|-
|E.1 ||0.57 ||Power pad to card edge side
|-
|E.2 ||1.57 ||Signal pad to card edge side
|-
|E.3 ||2.6 ||Power pad width
|-
|E.4 ||1.6 ||Signal pad width
|-
|E.5 ||0.94 ||Space between pads
|-
|E.6 ||2.54 ||Pad spacing
|}


== Famicom Cartridge pin dimensions ==
[[Category:Hardware]]
Each cartridge type varies in how the 60 pin card edge is implemented. The pin pitch is 2.54mm, with 2 rows of 30 pads. Each pad may be uniform in dimensions, or slightly thicker and longer for power/ground. This outline is based on measurements from a HVC-TGROM-01 cartridge, with bigger pads to accommodate power. Note that this outline also details where the soldermask ends for the card edge.
[[File:HVC-TGROM-01-card-edge.svg|frame|center|60 pin card edge outline and dimensions, based on HVC-TGROM-01]]

Latest revision as of 15:34, 18 September 2022

This page documents the dimensions of common Famicom cartridges, including their cartridge shell and their corresponding PCB type. The source files are open-source and available on Github.

TODO: identify more cartridge shell forms

Famicom cartridge shell outline

Small cartridge form

HVC-TxROM

TODO: measure and publish dimensions

HVC-NROM/CNROM

TODO: measure and publish dimensions

Large cartridge form

HVC-ExROM

TODO: measure and publish dimensions

Miscellaneous cartridge forms

TODO: document and measure other forms

Famicom cartridge PCB outline

These outlines of different cartridge PCB types are based on the most space-filling variant, so that designers may choose to cut off unused portions that their designs may not need. Some outlines of cartridges with no maximally space filling PCB are thus modified to be such, with measurements being based on adjacent types made by the same producer.

Each cartridge type varies in how the 60 pin card edge is implemented. The pin pitch is 2.54mm, with 2 rows of 30 pads. Each pad may be uniform in dimensions, or slightly thicker and longer for power/ground.

HVC-Ax/Fx/Px/Sx/TxROM (MMC1-4 mapper boards)

This outline is based on measurements from a HVC-TGROM-01 type cartridge PCB, compatible with any cartridge shell that supports any HVC-Ax/Fx/Px/Sx/TxROM PCB or similar/bigger. These measurements are measured with vernier calipers with 0.05 mm accuracy. Note that this outline also details where the soldermask ends for the card edge.

Technical drawing of the outlines of an HVC-TGROM-01 type cartridge PCB.
Dimensions
Designator Dimensions in mm (±0.05 mm) Description
A 90 Board width
A.1 78.4 Card edge width
A.2 81 Notched width
A.2.1 43 Inset board width 1
A.2.2 33 Inset board width 2
B 46.1 Board height
B.1 23.2 Inset board height 1
B.2 20.9 Inset board height 2
B.3 10.7 Card edge depth
C 1.2 Board thickness
D.1 3 Card edge base to pad top
D.2 4 Card edge base to soldermask keepout
D.3 6.7 Power pad height
D.4 5.7 Signal pad height
E.1 0.57 Power pad to card edge side
E.2 1.57 Signal pad to card edge side
E.3 2.6 Power pad width
E.4 1.6 Signal pad width
E.5 0.94 Space between pads
E.6 2.54 Pad spacing

HVC-ExROM

TODO: measure and publish dimensions

HVC-N/Cx/Gx/UxROM 01-05 (discrete mapper boards)

This outline is based on measurements from a HVC-CNROM-256K-01 type cartridge PCB, augmented with dimensions from a HVC-TGROM-01 type PCB. This is compatible with any cartridge shell that supports any HVC-N/Cx/Gx/UxROM 01-05 PCB or similar/bigger. These measurements are measured with vernier calipers with 0.05 mm accuracy. Note that this outline also details where the soldermask ends for the card edge.

Technical drawing of the outlines of an augmented HVC-CNROM-256K-01 type cartridge PCB.
Dimensions
Designator Dimensions in mm (±0.05 mm) Description
A 90 Board width
A.1 78.4 Card edge width
A.2 68 Notched width
A.2.1 31.5 Inset board width 1
A.2.2 26.5 Inset board width 2
A.3 39.5 Hole 1 to board edge
A.4 1/2 of A Hole 2 to board edge
A.5 3 Hole 1 diameter
A.6 5 Hole 2 diameter
B 46.1 Board height
B.1 23.2 Inset board height 1
B.2 20.9 Inset board height 2
B.3 10.7 Card edge depth
B.4 19.8 Hole 1 center height
B.5 10.3 Hole 2 center height
C 1.2 Board thickness
D.1 3 Card edge base to pad top
D.2 4 Card edge base to soldermask keepout
D.3 6.7 Power pad height
D.4 5.7 Signal pad height
E.1 0.57 Power pad to card edge side
E.2 1.57 Signal pad to card edge side
E.3 2.6 Power pad width
E.4 1.6 Signal pad width
E.5 0.94 Space between pads
E.6 2.54 Pad spacing
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